HUBER+SUHNER launches high-performance VITA 67.3 RF interconnect portfolio

Now availble from Lane Electroncs - the HUBER+SUHNER new VITA 67.3 RF interconnect portfolio designed to support OpenVPX - compliant connectivity in demanding aerospace and defence applications.

Built around the company’s proprietary solderless MINIBEND® RF cable termination technology, the new range delivers reliable, high-density, blind-mateable performance while helping engineers meet increasingly demanding miniaturisation requirements.

The VITA 67.3 standard supports reliable, high-frequency signal transmission by standardising blind-mate RF interfaces at the backplane. In practice, this helps reduce cable-management challenges while improving system modularity and scalability in mission-critical platforms.

For designers working in aerospace and defence, that means greater flexibility when integrating high-performance RF connectivity into compact, rugged system architectures.

As a member of The Open Group’s SOSA Consortium and the VITA Standards Organisation, HUBER+SUHNER brings decades of experience in high-performance, high-reliability connectivity. Its MINIBEND® technology is already well established for low-profile flexible cable assemblies, and this latest portfolio extends those benefits to VITA 67.3 applications.

With the launch of the new portfolio, engineers now have access to coaxial cable options featuring an exceptionally small bend radius immediately behind the RF contact, enabling very tight routing without compromising durability or performance.

Key features and benefits

• Complete VITA 67.3 RF connectivity portfolio featuring SMPM, SMPS and NanoRF interfaces, including hybrid RF/fibre optic configurations.
• Extensive cable and connector options for PCB and chassis connectivity, including high-frequency D38999 contact options up to 65 GHz.
• Competitive low-loss .047 and .086 cable options.
• Assemblies manufactured in accordance with IPC/WHMA-A-620 Class 3.
• Dedicated express production capability for made-to-order VITA 67.3 assemblies with short lead times.

Phil McDavitt, our Strategic Business Manager, said: “The new HUBER+SUHNER VITA 67.3 RF interconnect range is aimed at mission-system OEMs, integrators and embedded computing OEMs. It gives system designers access to market-leading solderless termination technology, enabling extremely tight and robust cable routing while supporting high levels of performance with premium cable options.”